Intel® Xeon® Processor Product Families and more...Industry’s Densest Intel® Xeon® UP and DP Servers:• Features Supermicro high-volume, low-power, high-density VLP memory • Redundant 10/2.5/1GbE SDN switches with 40/10Gbps uplinks• Redundant CMMs with management software• Intel® Xeon® processor E5-2600 v4 & Intel® Xeon® processor E3-1200 v5 product families supported December 2016New Generation X11 & X10 Solutions• NVMe • SAS 3.0 • 100G/40G/25G Ethernet • 100G IB/OPA • BBP® • SRSD3U/6U MicroBlade• Non-blocking architecture. No GPU preheating with Independent GPU and CPU thermal zones• 80GB/s NVLink GPU-GPU interconnect• RDMA via EDR / Omni-Path ensures lowest latency • Performance: up to 170 TFLOPS with 8 Pascal GPUs• 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots• 4x 2000W (2+2) Redundant Titanium Level power • 16 hot-swap 2.5” drive bays • Up to 2TB ECC DDR4-2400MHz in 16 DIMMs• Dual Intel® Xeon® processor E5-2600 v4/v3 product families supported GLOBAL SKUTITANIUM8x 300W Pascal GPU cards in 4U80GB/s NVLink Architecture• 60x 3.5” hot-swap SAS3/SATA3 drive bays, 2x 2.5” hot-swap drive bays (rear), 6x optional NVMe bays• SAS3 via LSI 3008 (IT mode) or 3108 w/ HW RAID • DP Xeon® 24 DIMMs, 2x 10G/40G/100G/25G• 2000W Redundant Titanium Level (96%+) power3U MicroBlade(MBE-314E-420) 6U MicroBlade(MBE-620E-820)60-Bay Top-Load Server4U 8 Pascal GPU (Tesla P100) Server 2U BigTwin™4 Hot-Swappable Nodes in 2U24 DIMMs, 2 PCI-E 3.0 x16 slots, 6 NVMe drives, and SIOM support per NodeSSG-6048R-E1CR60N/L60x 3.5” Hot-swap SAS3/SATA3 drive bays + 2 rear 2.5” bays + 6 NVMe (optional)14 Nodes in 3U MicroBlade SYS-4028GR-TXRTNew!Dual-Port NVMeSBB - 2 Redundant Nodes2U 40 Dual-Port NVMe2U 20 Dual-Port NVMe
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